Frore Systems Unveils LiquidJet Diamond Coldplates to Cool Nvidia and AMD AI Chips by 22C

Frore Systems has introduced its bespoke LiquidJet Diamond liquid-cooling coldplate series, a product designed to manage extreme heat generation in next-generation AI accelerators. According to a report by Tom's Hardware, the new cooling hardware targets specific hotspots on processors such as AMD’s Instinct MI400 and MI500-series, as well as Nvidia’s Rubin architecture.

How does the cooling technology work?

The LiquidJet Diamond coldplate integrates a diamond heat spreader directly into its bottom surface. This spreader positions diamond wafers above the GPU’s hottest areas to distribute thermal energy more efficiently before it reaches the liquid-cooling channels. Frore states that diamond possesses thermal conductivity exceeding 20 W/cm·K, which is significantly higher than the approximately 4 W/cm·K found in copper materials.

What performance gains does it offer?

Frore claims the new coldplates can handle hotspot power densities reaching 770 W/cm², an increase from the roughly 600 W/cm² supported by its original LiquidJet product. The company reports that the solution reduces GPU temperatures by 16C to 22C compared with conventional coldplates. Additionally, Frore estimates that this thermal improvement boosts AI token throughput per watt by as much as 35%, enhancing overall computational efficiency for data center operators.

How does it differ from previous models?

Unlike the LiquidJet Nexus, which integrates multiple coldplates into a large assembly for several processors, LiquidJet Diamond functions as an individual GPU coldplate. It retains the three-dimensional, ultra-short-loop, multi-stage architecture of the original LiquidJet but adds the diamond wafer layer. This bespoke design allows for coolant channels customized to the specific power distribution of a single processor, offering targeted cooling rather than a broader assembly approach.

What is missing from the technical details?

Frore has not disclosed how the diamond wafers are manufactured or integrated into the coldplate structure. The company provides simulation-based estimates for temperature reductions and efficiency gains. The lack of manufacturing transparency means the specific integration methods remain undisclosed, leaving only the performance metrics and material properties as public technical details for the LiquidJet Diamond series.

What to do and how to stay safe: Frore Systems

• Review current cooling infrastructure to identify hotspots that may exceed standard copper coldplate limits.
• Evaluate vendor claims regarding thermal conductivity and power density handling before committing to bespoke hardware.
• Monitor integration requirements for diamond-infused coldplates to ensure compatibility with existing server chassis and liquid loops.
• Assess the total cost of ownership, including potential maintenance issues related to novel materials like diamond wafers.

Step-by-step guide: AI Usage Policies at Work: How to Prevent Data Leakage

General security guidance from the TechSec Feed newsroom. It is not confirmed advice from the organisations named in this story.

Frequently asked questions

Which processors are compatible with the LiquidJet Diamond coldplate?

Frore states the coldplate is designed for next-generation AI accelerators, including AMD's Instinct MI400 and MI500-series and Nvidia's Rubin.

How much does it improve thermal performance?

Frore claims the solution reduces GPU temperatures by up to 22C and improves AI token throughput per watt by as much as 35%.

Is the manufacturing process for the diamond wafers public?

No, Frore has not disclosed how the diamond wafers are manufactured or integrated into the coldplate.